RFID Inlay Assembly Equipment DDA 20000

10 years ago, the Direct Die Attach concept was born in Mühlbauer‘s development department and continuously optimized. The patented technology beats the 40 000 UPH with only one place system and a 30% smaller footprint. The significantly higher throughput and the reduced complexity result in 80% less die attach costs, an outstanding quality and highest reliability. This system redefines the high-volume production and provides high potential for further cost and performance optimization.