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Description
1. It can quickly transfer heat from the chip to the heatsink while also being an excellent electrical insulator. Used in high-voltage environments like CPUs, graphics cards, and power modules, it can effectively prevent short circuits.
2. It's very soft and highly compressible, able to perfectly fill the tiny bumps and gaps between the heat-generating components and the heatsink that you can't see with the naked eye, pushing out the air inside, which greatly reduces thermal resistance and improves heat dissipation efficiency.
3. Because it has its own elasticity, when placed between the heat-generating component and the heatsink, it also acts as a physical cushion, effectively protecting delicate chips (like smartphone motherboards or LED beads) from cracking at the solder joints caused by vibrations and shocks.
2. It's very soft and highly compressible, able to perfectly fill the tiny bumps and gaps between the heat-generating components and the heatsink that you can't see with the naked eye, pushing out the air inside, which greatly reduces thermal resistance and improves heat dissipation efficiency.
3. Because it has its own elasticity, when placed between the heat-generating component and the heatsink, it also acts as a physical cushion, effectively protecting delicate chips (like smartphone motherboards or LED beads) from cracking at the solder joints caused by vibrations and shocks.
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